A diamond wire coolant suitable for cutting large-sized silicon wafers
Invention patent
Patent Name
A diamond wire coolant suitable for cutting large-sized silicon wafers
Application No.
CN202610049940.2
Publication No.
CN121873873A
Publication Date
2026-04-17
Applicant
Xiangzhe Technology (Hubei) Co., LTD
Patent Type
Invention patent
Legal Status
The substantive examination came into effect on May 5, 2026; The invention patent application was published on April 17, 2026
Abstract
Application Number: CN202610049940.2 Application Date: January 15, 2026 Publication/Announcement Number: CN121873873A Publication/Announcement Date: A...
Abstract Figure
