Products
This product is a high-efficiency diamond wire cutting fluid (BCF-01) mainly used for processing solar-grade silicon rods. BCF-01 features outstanding...
This product is a high-performance diamond wire cutting fluid mainly used for processing solar-grade silicon rods. The product features excellent cool...
This product is a high-performance diamond wire cutting fluid mainly used for processing solar-grade silicon rods. The product features a high content...
Compared with traditional lactic acid degumming, the silicon wafer degumming agent SWD-01 has the characteristics of low degumming cost, fast speed an...
Product Introduction of Single Crystal Texturing Additive XZ-131 Silicon Wafer Single Crystal Texturing Aid XZ-131 is a single crystal texturing addit...
The two-component silicon wafer cleaner SWC-01 is composed of multiple surfactants and special additives, including the components SWC-01A and SWC-01B...
Product Introduction of BCF-02 Water-based Wire Saw Cutting Fluid for Third-Generation Semiconductor SiC Single Crystal Substrate: This product is a w...
Product Introduction of BCF-02 Silicon Carbide Cutting Fluid: BCF-02 Silicon carbide Cutting Fluid is a non-hazardous substance mixture, composed of w...
Product Introduction of Silicon Wafer Cleaning Agent XZ-121B Silicon Wafer Cleaning Component B: XZ-121B is the B agent of silicon wafer cleaning agen...
Product Introduction of Silicon Wafer Cleaning Agent XZ-121A Silicon Wafer Cleaning Component A: XZ-121A is the A agent of silicon wafer cleaning agen...
Product Introduction of Silicon Wafer Cleaning Agent XZ-121 (A/B) Special Cleaning Agent for Diamond Wire Silicon Wafers: This product is developed sp...
Product Introduction of Single Crystal Texturing Additive XZ-131 Diamond Wire Single Crystal Silicon Wafer Texturing Assistant: This product is mainly...
