Products
Product Introduction of BCF-01 Semiconductor Wafer Diamond Wire Water-based Cutting Fluid: This product is a water-based cutting fluid specially desig...
Product Introduction of BCF-01 Wafer Cutting Fluid: BCF-01 Wafer Cutting Fluid is a non-hazardous substance mixture, composed of wetting agents, lubri...
Round rod splicing adhesive BSA-01A/B is mainly used for the splicing process of short rods after the crystal pulling process is completed. The produc...
