A wire cutting coolant for silicon carbide wafer cutting
Invention patent
Patent Name
A wire cutting coolant for silicon carbide wafer cutting
Application No.
CN202610057282.1
Publication No.
CN121914795A
Publication Date
2026-04-24
Applicant
Xiangzhe Technology (Hubei) Co., LTD
Patent Type
Invention patent
Legal Status
The substantive examination came into effect on May 12, 2026; The invention patent application was published on April 24, 2026
Abstract
Application Number: CN202610057282.1 Application Date: January 16, 2026 Publication/Announcement Number: CN121914795A Publication/Announcement Date: A...
Abstract Figure
