Product Introduction

This product is a water-based cutting fluid specially designed for cutting semiconductor wafers with diamond wire saws. It is scientifically compounded from multiple high-performance surfactants and integrates the functions of lubrication, wetting, dispersion, cooling and cleaning. The product significantly reduces the frictional resistance in the cutting zone, rapidly wets the surface of the silicon rod, and stably disperses the silicon powder particles generated during cutting, effectively suppressing the wear of wire saws and surface defects of silicon wafers, thereby comprehensively enhancing the geometric accuracy and surface quality of the wafers after cutting. The product is environmentally friendly, low-foaming and easy to clean, and it is a key process consumable in the semiconductor wafer manufacturing process.

Product features

• Excellent penetration lubrication: The low surface tension formula quickly penetrates the micron gaps, forming a lubricating film, reducing cutting resistance, lowering micro-cracks, line marks, and hidden cracks, and extending the service life of diamond wires.
• High-efficiency cooling and temperature control: The water-based substrate conducts heat quickly, rapidly removing the cutting heat, reducing warpage deformation caused by thermal stress, and stabilizing the temperature window of the cutting process.
• Silicon powder dispersion and anti-deposition: Effectively disperse silicon powder chips to prevent agglomeration and wafer scratching. When combined with a filtration system, it achieves solid-liquid separation, ensuring stable performance of the bath solution.
• Low-foaming, no additional defoamer required: Built-in polyether anti-foaming component, almost no stubborn foam, avoiding overflow and bubble entrapment causing line breakage.
• Easy to clean and residue-free: Free of mineral oil, the wafers are easy to clean after cutting, with no white spots or organic residues, and are compatible with subsequent processes such as texturing, polishing, and epitaxy.
• Stable, environmentally friendly and compliant: It is not prone to stratification and precipitation during recycling, has low COD, contains no halogen or heavy metals, and meets RoHS environmental protection requirements.

Physical and chemical indicators

Usage method

It is recommended to dilute 1L of cutting fluid with a ratio of 100-200L of pure water for use. Appropriate adjustments can be made according to the on-site cutting conditions.

Precautions

If stratification occurs after long-term storage, stir evenly and it will not affect the usage effect. When operating, take good personal protective measures and avoid prolonged contact with eyes and skin.

Storage and transportation

Store in a sealed container in a cool and dry place.
2. This product is non-toxic and non-hazardous. The shelf life of the product is one year from the date of production.

Specification

Product advantages