Product Introduction
Round rod splicing adhesive BSA-01A/B is mainly used for the splicing process of short rods after the crystal pulling process is completed. The product has excellent bonding performance. After the two components A and B are mixed in a certain proportion and cured, they have a relatively high hardness, which is convenient for the subsequent square opening process of the silicon rod. In addition, after the product is cured, it can be smoothly removed by boiling in water.
Product features
- Bonding performance: It can be fully cured within 5 to 15 minutes at room temperature and has a relatively high bonding strength.
- Anti-slip marking performance: After the product is cured, the adhesive layer exhibits the characteristics of high hardness and high modulus, and is less likely to leave scratches during grinding.
- Easy de-gumming performance: It can quickly dissolve and de-gumming after being boiled in water.
- Weather resistance: The curing time and physical properties are almost unaffected by sudden changes in environmental factors.
Physical and chemical indicators
| Project | Indicator |
|---|---|
| Appearance | A: White; B: Blue |
| Viscosity (cps, 25℃) | 20,000 to 3,000,000 |
| Operating time (25℃ | 5 to 15 minutes |
| Shore hardness (D | ≥85 |
| Shear strength of the adhesive layer (MPa | ≥13 |
Usage method
It is recommended that the glue be prepared and used immediately. That is, mix it in a 1:1 mass ratio and then bond it. The application of the glue should be completed within 5 to 15 minutes, and it can be cut and sanded 2 hours later.
Precautions
It is a normal phenomenon for the product surface to have rubber. Just remove the rubber and it can be used normally.
Storage and transportation
Store in a sealed container in a cool and dry place, away from direct sunlight.
The shelf life of the product is half a year from the date of production.
Specification
1kg or customer-customized packaging.