Products
This product is a high-efficiency diamond wire cutting fluid (BCF-01) mainly used for processing solar-grade silicon rods. BCF-01 features outstanding...
This product is a high-performance diamond wire cutting fluid mainly used for processing solar-grade silicon rods. The product features excellent cool...
This product is a high-performance diamond wire cutting fluid mainly used for processing solar-grade silicon rods. The product features a high content...
Product Introduction of BCF-02 Water-based Wire Saw Cutting Fluid for Third-Generation Semiconductor SiC Single Crystal Substrate: This product is a w...
Product Introduction of BCF-02 Silicon Carbide Cutting Fluid: BCF-02 Silicon carbide Cutting Fluid is a non-hazardous substance mixture, composed of w...
