Product Introduction
WCF-G01 is a water-based cutting fluid for glass material cutting. It features non-toxicity, non-irritation, rapid chip removal, resistance to hard water, rust prevention and strong lubrication. It is suitable for cutting hard and brittle glass materials such as optical glass, microcrystalline glass, sapphire glass and ceramic wafers with diamond wire saws/tools. This product has a wide range of applications, covering precision processing scenarios such as mobile phone glass covers and camera lenses.
Product features
- Hard water resistance: Inhibits the negative impact of metal ions released from glass materials into water bodies on cutting.
- Lubrication performance: Ensures processing accuracy, reduces the wear of workpieces and tools, and minimizes problems such as chipping.
Physical and chemical indicators
| Project | Indicator |
|---|---|
| Appearance | Colorless to brownish-yellow liquid |
| Density (g/cm³, 25℃) | 0.900～1.200 |
| pH value (1/10 aq.) | 6.0～12.0 |
| Conductivity (1/10 aq., mS/cm) | ≤15 |
Usage method
Recommended usage method: Add 20 to 25 liters of cutting fluid to 200 to 400 liters of pure water, stir evenly, and then make 5 to 10 cuts. Then, add cutting fluid appropriately and make 3 to 5 more cuts before discharging the cutting wastewater.
Precautions
This product may stratify after being stored for a long time at extreme high or low temperatures. However, stirring evenly will not affect the usage effect.
Storage and transportation
Store in a sealed container in a cool and dry place.
2. The shelf life of the product is one year from the date of production.
Specification
25kg, 1000kg or customer-customized packaging.