Product Introduction

Bcf-01 wafer cutting fluid is a non-hazardous substance mixture, composed of wetting agents, lubricants, stabilizers, functional additives and water. It is suitable for the wire saw cutting process of wafers and serves the functions of wetting, lubricating, cooling and chip removal.

Product features

• Wetting and penetration: The wetting components quickly penetrate the cutting gap, improving the state of the cutting interface.
• Lubrication and friction reduction: Lubricants reduce the friction between the diamond wire and the wafer, minimizing wire loss.
• System stability: The stabilizer ensures the stability of the bath solution and inhibits the agglomeration and sedimentation of cutting debris.
• Water-based system: It can be dispersed in water and is convenient for on-site dilution and mixing for use.

Physical and chemical indicators

Usage method

Dilute and prepare the bath solution with water in accordance with the on-site cutting process requirements. Replenish or replace the cutting fluid in a timely manner based on the cutting effect and the loss of the bath solution.

Precautions

Wear anti-permeable PVC gloves, safety goggles and protective clothing when operating. Avoid direct contact with skin and eyes; Avoid contact with strong oxidants, strong acids and strong alkalis. Do not directly discharge into the environment. In case of leakage, collect it with inert adsorption materials and dispose of it in compliance with regulations.

Storage and transportation

Store in a sealed container in a dry and well-ventilated warehouse.
2. During transportation and inspection, the packaging must be intact and sealed. It is strictly prohibited to mix and transport with strong oxidants or edible chemicals. This product is not classified as a dangerous good. The shelf life of the product is one year from the date of production.

Specification

Product advantages