Product Introduction
Compared with traditional lactic acid degumming, the silicon wafer degumming agent SWD-01 has the characteristics of low degumming cost, fast speed and small odor. This product has a good penetration and swelling separation effect on the curing adhesive between the silicon rod and the resin plate. At the same time, it has a certain dispersion ability for silicon powder, which is convenient for the subsequent silicon wafer cleaning process.
Product features
- Swelling performance: Fast swelling speed, high degumming efficiency, and suppression of silicon wafer chipping problems caused during the degumming process.
- Dispersion performance: Inhibits the agglomeration of silicon powder and has a certain dispersion ability for silicon powder on the surface of silicon wafers.
- Stability: The proportion of each component in the product fluctuates little, and its service life is long.
Physical and chemical indicators
| Project | Indicator |
|---|---|
| Appearance | Yellow to dark brown liquid |
| Density (g/cm³, 25℃) | 1.000～1.300 |
| pH value (25℃ | ≤3.0 |
Usage method
The recommended process parameters for use are: a concentration of 5% to 30%, a degumming temperature of 55 to 70℃, and a degumming time of 5 to 20 minutes. The specific parameters such as the usage ratio, degumming temperature and degumming time can be adjusted according to the actual situation. The complete detachment of the silicon wafer is regarded as the end of degumming.
Precautions
This product may stratify after being stored for a long time at extreme high or low temperatures. However, stirring evenly will not affect the usage effect.
Storage and transportation
Store in a sealed container in a cool and dry place.
2. The shelf life of the product is one year from the date of production.
Specification
25kg/1000kg or customer-customized packaging.